MERC was tasked to perform structural and thermal analysis on three Circuit Card Assemblies (CCAs) designed as replacements for cards currently operating in an airborne targeting computer.
MERC performed structural and thermal analysis on the CCAs. The purpose of the thermal analysis was to predict component junction temperatures under worst-case conditions and compare these temperatures to the operating limits for the components.
MERC developed a thermal finite element model which included the electronic components, circuit card assemblies, and mounting frames in order to determine the predicted component temperature rise under worst-case operating conditions at 30,000 ft.
MERC also performed modal analysis and predicted worst-case deflections for the circuit cards in order to assess fatigue life for the system in the airborne environment.
Learn more about MERC’s structural analysis capabilities.